They are invisible and very difficult to measure but no life in the oceans would be possible without them. We are talking about trace metals such as cadmium, copper or iron, dissolved in seawater. Their precise origin and distribution in... (Continue reading)
Director General Daniel Liao of Taipei Economic and Cultural Office (TECO) in Seattle, accompanied by Division Director Jason Huang, visited two Taiwanese investors in Southern Washington State on January 13 en route to Portland, Oregon. Liao first met with Jason Hung,... (Continue reading)
ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic or ceramic substrate and completed full reliability testing. This 3D integration of substrates is all made possible with... (Continue reading)
In December, ALLVIA announced that it purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of... (Continue reading)
ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square... (Continue reading)
ATREG, a division of Colliers International, announced their formal appointment as advisor to IDT((R) ) (NASDAQ: IDTI) , in the sale of IDT’s operational 200mm semiconductor manufacturing facility in Hillsboro, Oregon. The offering includes SMIF process tools... (Continue reading)
Deep Photonics the ultra fast fiber laser company for the semiconductor, electronics and photovoltaic marketplace, announced the opening of a new materials processing applications lab at its corporate headquarters in Corvallis, Oregon. The 1,500 sq. ft. clean room enables Deep... (Continue reading)