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STI Electronics to Feature Engineering Services at Space & Missile Defense Conference & Exhibition
Written on 27 Jul, 2010 at 15:30 in Interest | viewed 1,096 times | 0 Comments
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled... (Continue reading)
New Microelectronic Facility for Axis
Written on 9 Feb, 2010 at 14:30 in News | viewed 321 times | 0 Comments
Axis Electronics announces the opening of a new microelectronic facility at Axis. From March 2010 the company will be offering microelectronic assembly services including manual/automatic die bonding and manual/automatic wire/tape bonding, both as part of multichip module (MCM) and chip... (Continue reading)
New Cleanroom Facility for Axis in Bedford, UK
Written on 18 Jan, 2010 at 13:59 in News | viewed 274 times | 0 Comments
Axis Electronics announces the opening of a new microelectronic facility at Axis. From March 2010 the company will be offering microelectronic assembly services including manual/automatic die bonding and manual/automatic wire/tape bonding, both as part of multichip module (MCM) and chip... (Continue reading)
First Through-Silicon Via Foundry, ALLVIA, Completes Reliability Testing of Silicon Interposer
Written on 14 Jan, 2010 at 18:28 in Research | viewed 328 times | 0 Comments
ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic or ceramic substrate and completed full reliability testing. This 3D integration of substrates is all made possible with... (Continue reading)
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