SEMATECH and Lasertec Partner at UAlbany NanoCollege to Develop TSV Solutions for Chip-Stacking Applications

Lasertec Corporation of Japan has joined SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume... (Continue reading)