New Cleanroom Facility for Axis in Bedford, UK

Written on 18 Jan, 2010 at 13:59 in News | viewed 274 times | 0 Comments

Axis Electronics announces the opening of a new microelectronic facility at Axis. From March 2010 the company will be offering microelectronic assembly services including manual/automatic die bonding and manual/automatic wire/tape bonding, both as part of multichip module (MCM) and chip... (Continue reading)