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First Through-Silicon Via Foundry, ALLVIA, Completes Reliability Testing of Silicon Interposer

Written on 14 Jan, 2010 at 18:28 in Research | viewed 328 times | 0 Comments

ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic or ceramic substrate and completed full reliability testing. This 3D integration of substrates is all made possible with... (Continue reading)

ALLVIA Purchase Facility In Hillsboro, Oregon

Written on 14 Jan, 2010 at 16:27 in News | viewed 470 times | 0 Comments

In December, ALLVIA announced that it purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of... (Continue reading)

Tagged with: ALLVIA first through-silicon via Hillsboro manufacturing facility Oregon Silicon Valley TSV

ALLVIA Acquires Manufacturing Site in Oregon

Written on 27 Oct, 2009 at 11:14 in News | viewed 231 times | 0 Comments

ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square... (Continue reading)

Tagged with: ALLVIA CA Hillsboro Oregon semiconductor Sunnyvale through-silicon TSV technology