New Cleanroom Facility for Axis in Bedford, UK
Axis Electronics announces the opening of a new microelectronic facility at Axis. From March 2010 the company will be offering microelectronic assembly services including manual/automatic die bonding and manual/automatic wire/tape bonding, both as part of multichip module (MCM) and chip on board (COB) style assemblies. Included in the service will be a bespoke and prototype microassembly capability.
The facility will be located in the Bedford plant and will consist of a class 10,000 cleanroom with temperature and humidity controls. The cleanroom will house a comprehensive range of equipment to suit a wide range of applications including; a die handling robot, two automatic wire bonders, three semi-automatic bonders, one manual ball bonder, a pull/shear tester, as well as two environmental chambers.
The cleanroom will be headed up by Engineering Manager, Matt Turner who held a similar position with Texas Instruments before joining Axis Electronics. “We are very fortunate to have skilled people locally who have excellent experience using the exact equipment and processes.” commented Matt Turner, Engineering Manager.
Source : Axis Electronics