ALLVIA Purchase Facility In Hillsboro, Oregon
In December, ALLVIA announced that it purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of cleanroom capacity. The cleanroom is expandable to 80,000 square feet.
Located in Silicon Valley, ALLVIA (http://www.allvia.com/) is the first through-silicon via (TSV) foundry. ALLVIA introduced the term, through-silicon via, in a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, and CMP.
Source : ALLVIA